• DocumentCode
    941179
  • Title

    56th Electronic Components and Packaging Conference (ECPC 2006)

  • Volume
    29
  • Issue
    2
  • fYear
    2006
  • fDate
    4/1/2006 12:00:00 AM
  • Firstpage
    137
  • Lastpage
    137
  • Abstract
    Provides notice of upcoming conference events of interest to practitioners and researchers.
  • Keywords
    Electronic components; Electronics packaging;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2006.876552
  • Filename
    1634457
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=941179