DocumentCode
944332
Title
Stability tests of module coil (TOKI-MC) wound with an aluminum stabilized superconductor
Author
Mito, T. ; Sakamoto, M. ; Takahata, K. ; Yanagi, N. ; Nishimura, A. ; Yamada, S. ; Motojima, O. ; Yamamoto, J.
Author_Institution
Nat. Inst. of Fusion Sci., Gifu, Japan
Volume
3
Issue
1
fYear
1993
fDate
3/1/1993 12:00:00 AM
Firstpage
547
Lastpage
550
Abstract
The module coil TOKI-MC is a twisted solenoid coil wound with an aluminum stabilized superconductor developed as an R&D program for the Large Helical Device (LHD). The TOKI-MC can simulate the conductor and winding structure cooled by pool boiling helium, the twisted winding and the large electromagnetic force of the helical coils for LHD. The TOKI-MC was designed as a cryostable coil at an operating current of 20 kA, but the coil quenched around 17 kA in excitation tests. The cause of quenches was thought to be the result of wire movement. Stability tests were also carried out and the measured recovery current was less than the designed value. The degradation of recovery current was due to the excess magnetoresistivity of the copper clad aluminum stabilizer. The stability of TOKI-MC was evaluated and compared with the data of short sample tests.<>
Keywords
copper; fusion reactor theory and design; niobium alloys; superconducting cables; superconducting magnets; titanium alloys; 17 kA; 20 kA; 4.2 K; 8 T; Cu-Al stabilised superconductor; LHD helical coils; Large Helical Device; NbTi-Cu compacted strand cable; R&D program; cryostable coil; electromagnetic force; excitation tests; fusion reactor; magnetoresistivity; module coil TOKI-MC; operating current; pool boiling He; quenching; recovery current; simulation; stability test; twisted solenoid coil; twisted winding; wire movement; Aluminum; Conductors; Electromagnetic forces; Solenoids; Stability; Superconducting coils; Testing; Wire; Wounds;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/77.233764
Filename
233764
Link To Document