• DocumentCode
    944823
  • Title

    SSC-VQP-status of the manufacture at AISA of SSC outer wire and cable

  • Author

    Ky, H.G. ; Sulten, P. ; Grunblatt, G. ; Mougenot, P.

  • Author_Institution
    Alsthom Intermagnetics SA, Belfort, France
  • Volume
    3
  • Issue
    1
  • fYear
    1993
  • fDate
    3/1/1993 12:00:00 AM
  • Firstpage
    717
  • Lastpage
    720
  • Abstract
    Single stacking billets were processed to manufacture Superconducting Super Collider (SSC) outer wire and cable as part of the SSC vendor qualification program. The authors report the production results and the main performance parameters of the wire manufactured. Phase IA and Phase IB results are discussed. Phase IA of this program related to manufacturing 15 different versions of SSC outer wire to investigate the effects of design and process parameters, e.g., NbTi source, billet design, Nb thickness, etc., on the wire critical current density and piece length as well as on the production yield. With regard to phase IB, 23 multifilament billets were processed to produce SSC outer cable with the Alsthom Intermagnetics SA (AISA) baseline design and process.<>
  • Keywords
    beam handling equipment; critical current density (superconductivity); niobium alloys; proton accelerators; superconducting cables; superconducting magnets; superconducting materials; synchrotrons; titanium alloys; AISA; Alsthom Intermagnetics SA; Nb thickness; NbTi source; Phase IA; Phase IB results; SSC outer wire; SSC vendor qualification program; SSC-VQP; Superconducting Super Collider; baseline design; billet design; cable; critical current density; manufacture; performance parameters; piece length; production results; production yield; stacking billets; superconducting magnet; Billets; Manufacturing processes; Multifilamentary superconductors; Niobium compounds; Process design; Production; Qualifications; Stacking; Superconducting cables; Superconducting filaments and wires;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.233804
  • Filename
    233804