• DocumentCode
    945234
  • Title

    Evaluation of technology options for LSI processing elements

  • Author

    Verhofstadt, Peter W J

  • Author_Institution
    Fairchild Camera and Instrument, Mountain View, CA
  • Volume
    64
  • Issue
    6
  • fYear
    1976
  • fDate
    6/1/1976 12:00:00 AM
  • Firstpage
    842
  • Lastpage
    851
  • Abstract
    A general overview of the semiconductor technologies available for the manufacture of microprocessor and bit slices is given. Both MOS as well as bipolar processes are covered. Advantages and disadvantages of PMOS, NMOS, CMOS, TTL, ECL, and I2L are discussed. Several of the more special-purpose technologies are briefly mentioned. A comparison is done on the basis of performance, cost, and application, and suggestions are made as to which technology will service best which application. A general prediction is made as to which processes will survive as main stream technologies and what developments can be expected in the near future with respect to improvements. Applications are separated into cost-sensitive low-chip-count areas and high-performance bit-slice-oriented approaches.
  • Keywords
    CMOS technology; Costs; Fabrication; Helium; Large scale integration; MOS devices; Manufacturing processes; Microprocessors; Semiconductor materials; Silicon;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/PROC.1976.10234
  • Filename
    1454503