DocumentCode
945234
Title
Evaluation of technology options for LSI processing elements
Author
Verhofstadt, Peter W J
Author_Institution
Fairchild Camera and Instrument, Mountain View, CA
Volume
64
Issue
6
fYear
1976
fDate
6/1/1976 12:00:00 AM
Firstpage
842
Lastpage
851
Abstract
A general overview of the semiconductor technologies available for the manufacture of microprocessor and bit slices is given. Both MOS as well as bipolar processes are covered. Advantages and disadvantages of PMOS, NMOS, CMOS, TTL, ECL, and I2L are discussed. Several of the more special-purpose technologies are briefly mentioned. A comparison is done on the basis of performance, cost, and application, and suggestions are made as to which technology will service best which application. A general prediction is made as to which processes will survive as main stream technologies and what developments can be expected in the near future with respect to improvements. Applications are separated into cost-sensitive low-chip-count areas and high-performance bit-slice-oriented approaches.
Keywords
CMOS technology; Costs; Fabrication; Helium; Large scale integration; MOS devices; Manufacturing processes; Microprocessors; Semiconductor materials; Silicon;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1976.10234
Filename
1454503
Link To Document