Pb-Sn Alloy Microstructure: Potential Reliability Indicator for Interconnects

Author

O´Clock, George D. ; Peters, Michael S. ; Pater, Joleen R. ; Kleese, Greg A. ; Martini, Robert V.

Author_Institution

Mankato State University,MN

Volume

10

Issue

1

fYear

1987

fDate

3/1/1987 12:00:00 AM

Firstpage

82

Lastpage

88

Abstract

Investigation of the microstructure and chemistry of Pb-Sn alloy interconnects by scanning electron microscopy (SEM) and X-ray microanalysis shows that certain physical and chemical characteristics of the Pb-rich and Sn-rich phases are indicative of crack formation during temperature cycling. Those solder alloy interconnects that crack when temperature cycled exhibit significantly different microstructure patterns compared with solder interconnects that do not crack. Energy dispersive X-ray (EDX) data indicate that cracking is more pronounced when impurities such as Al, Au, or W are inadvertently introduced into the alloy material.

Keywords

Component reliability; Integrated circuit interconnections; Interconnections, Integrated circuits; Aluminum alloys; Capacitive sensors; Chemicals; Gold alloys; Impurities; Intermetallic; Microstructure; Scanning electron microscopy; Temperature dependence; Testing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/TCHMT.1987.1134704

Filename

1134704