DocumentCode
951422
Title
The IEEE Compliant Lead Task Force
Author
Balde, Jack
Author_Institution
Interconnection Decision Consulting,NJ
Volume
10
Issue
3
fYear
1987
fDate
9/1/1987 12:00:00 AM
Firstpage
463
Lastpage
469
Abstract
The leads of leadless chip carrier packages need to be yielding or compliant so that stresses on the solder Joints are minimal. These stresses are caused both by differences in the thermal expansions of the package and the material but also by board flexing. A special task force of the IEEE has determined that there are major differences between packages from different vendors, and that the differences are relevant. Guidelines are furnished to enable the systems engineer to estimate probable useful life for board assemblies of surface-mounted "J" leaded packages.
Keywords
Computer aided manufacturing; Electronic packaging thermal management; Electronics packaging; Lead; Packaging machines; Plastic packaging; Semiconductor device packaging; Soldering; Testing; Thermal stresses;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1987.1134749
Filename
1134749
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