DocumentCode
951458
Title
Elastoplastic Analysis of Surface-Mount Solder Joints
Author
Lau, John H. ; Rice, Donald W. ; Avery, Phil A.
Author_Institution
Hewlwtt-Packard Lab, CA
Volume
10
Issue
3
fYear
1987
fDate
9/1/1987 12:00:00 AM
Firstpage
346
Lastpage
357
Abstract
Thermal strain in surface-mount chip resistor assemblies is studied by the finite element method using two- and three-dimensional models. Emphasis is placed on the effects of interconnection geometry on solder joint fatigue. Nine different solder joint geometries are considered.
Keywords
Component reliability; FEM; Finite-element method (FEM); Resistors; Solders; Strain; Surface mounting; Thermal factors; Assembly; Capacitive sensors; Electronic equipment testing; Fatigue; Finite element methods; Geometry; Integrated circuit interconnections; Soldering; Surface-mount technology; Thermal stresses;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1987.1134753
Filename
1134753
Link To Document