DocumentCode
951610
Title
Foreword
Author
Angevine, A. ; Panousis, N.
Author_Institution
IBM Corporation
Volume
10
Issue
3
fYear
1987
fDate
9/1/1987 12:00:00 AM
Firstpage
302
Lastpage
302
Keywords
Bonding; Electronics packaging; Manufacturing automation; Manufacturing processes; Materials reliability; Paper technology; Process control; Pulp manufacturing; Sampling methods; Surface-mount technology;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1987.1134767
Filename
1134767
Link To Document