Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Author

Nishimura, Asao ; Tatemichi, Akihiro ; Miura, Hideo ; Sakamoto, Tatsuji

Author_Institution

Hitachi Ltd,Japan

Volume

10

Issue

4

fYear

1987

fDate

12/1/1987 12:00:00 AM

Firstpage

637

Lastpage

642

Abstract

The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range $\\Delta$ K. The crack propagation behavior in the package was estimated from the data of da/dN and $\\Delta$ K at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package Cracking problem is demonstrated.

Keywords

Integrated circuit packaging; Integrated circuit thermal factors; Life estimation; Circuit testing; Fatigue; Finite element methods; Integrated circuit packaging; Laboratories; Length measurement; Life estimation; Plastic integrated circuit packaging; Stress; Temperature distribution;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/TCHMT.1987.1134777

Filename

1134777