DocumentCode
957099
Title
The Use of Adhesives and Sealants in Electronics
Author
Delollis, N.
Author_Institution
Sandia Corporation, Sandia Base,Albuquerque, N.Mex
Volume
1
Issue
3
fYear
1965
fDate
12/1/1965 12:00:00 AM
Firstpage
4
Lastpage
16
Abstract
This paper surveys the wide variety of resin compounds available to meet the demands of modern electronics. It describes the properties and characteristics relevant to choosing a compound for a required performance and reliability and presents some guides for selection and use. Experimental data supports the discussion and comparison of resin properties.
Keywords
Adhesives; Elastomers; Epoxies; Polysulphides; Polyurethanes; Resins; Sealants; Silicones; Synthetics; Bonding; Curing; Epoxy resins; Gases; Moisture; Rubber; Sealing materials; Solvents; Temperature dependence; Temperature sensors;
fLanguage
English
Journal_Title
Parts, Materials and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0018-9502
Type
jour
DOI
10.1109/TPMP.1965.1135404
Filename
1135404
Link To Document