• DocumentCode
    957353
  • Title

    Reflection coil packaging for bubble devices

  • Author

    Takasu, Masaki ; Maegawa, Harumi ; Sukeda, Toshiaki ; Yamagishi, K.

  • Author_Institution
    Fujitsu Laboratories Ltd., Kawaski, Japan
  • Volume
    11
  • Issue
    5
  • fYear
    1975
  • fDate
    9/1/1975 12:00:00 AM
  • Firstpage
    1151
  • Lastpage
    1153
  • Abstract
    A new packaging technique for field accessed bubble devices, named "REFLECTION COIL PACKAGING", is proposed. The "REFLECTION COIL PACKAGING", comprising flat coils and a conductor plate with attached bubble chips, is characterized by ease of assembly, good thermal properties and low induced noise; it also has a potential capability for high-speed (up to 1 MHz) operations. Described in this paper are the concept of the "REFLECTION COIL PACKAGING", its basic characteristics and experimental results on the prototype high-speed module.
  • Keywords
    Magnetic bubble devices; Packaging; Acoustic reflection; Assembly; Ceramics; Coils; Conductors; Electronic packaging thermal management; Mass production; Noise level; Temperature measurement; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.1975.1058941
  • Filename
    1058941
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=957353