DocumentCode
958543
Title
Current Topics in the Surface Chemistry of Electric Contacts
Author
Antler, M.
Author_Institution
Burndy Corp.,Norwalk,Conn
Issue
3
fYear
1966
fDate
9/1/1966 12:00:00 AM
Firstpage
59
Lastpage
67
Abstract
This paper describes recent work in the science of the separable electronic pressure contact with emphasis on chemical factors in performance. The following topics are discussed: growth and morphology of sulfide tarnish films which creep across the interface between gold plate and silver or copper alloys and degrade contact performance; the formation and structure of corrosion solids on porous gold electroplated contacts, and which originate in atmospheres polluted with sulfur dioxide or hygroscopic dusts; new developments in measuring the porosity in precious metal plates; the critical dependence of the porosity of gold plate on substrate roughness; and new concepts for developing electronic connectors with contacts made of base metals.
Keywords
Air pollution; Contact resistance (CR); Contacts; Corrosion; Dust; Electrodeposists; Electrography; Failure mechanisms; Porosity; Probe; Sulfide creep; Tarnish; Chemicals; Chemistry; Contacts; Copper alloys; Corrosion; Creep; Degradation; Gold; Silver; Surface morphology;
fLanguage
English
Journal_Title
Parts, Materials and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0018-9502
Type
jour
DOI
10.1109/TPMP.1966.1135555
Filename
1135555
Link To Document