DocumentCode
959607
Title
Properties of Low Anodization Voltage Thin-Film Capacitors Based on
-Ta with Nitrogen Concentrations Between 14 and 30 Atomic Percent
Author
Rottersman, Myron H. ; Pitetti, Raymond C. ; Adolt, A. Robert ; Bill, Michael J.
Author_Institution
Bell Lab., INc., PA and Taylor Instru. Inc., NY
Volume
3
Issue
4
fYear
1980
fDate
12/1/1980 12:00:00 AM
Firstpage
500
Lastpage
504
Abstract
Tantalum oxide thin-film capacitors have been made with capacitance densities up to about a factor of three greater than those currently used for the fabrication of precision resistor-capacitor (RC) filters based on nitrogen-doped Ta films. This is accomplished by decreasing the dielectric thickness via reduction of the anodization voltage from 190 V to as low as 70 V. The dissipation factor, temperature coefficient of capacitance, and dc leakage current, after appropriate heat treatment, are only slightly higher than those of capacitors anodized at 190 V; however, the effects of nitrogen concentration in the alpha-Ta films become more significant. In addition, the expected long-term aging (20 years, 65°C) of capacitors anodized to either 90 V or 190 V is about equivalent.
Keywords
Tantalum alloys/compounds, devices; Thin-film capacitors; Capacitance; Capacitors; Dielectric thin films; Fabrication; Filters; Leakage current; Low voltage; Nitrogen; Temperature; Transistors;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1980.1135668
Filename
1135668
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