DocumentCode
959806
Title
TDMR Packaging Special Issue
Author
Danto, Yves ; Ciappa, Mauro
Volume
8
Issue
3
fYear
2008
Firstpage
441
Lastpage
441
Abstract
The one invited and six contributed papers in this special section present new studies in the field of packaging reliability.
Keywords
Aging; Assembly; Chemistry; Electronic packaging thermal management; Electronics packaging; Humans; Materials reliability; Materials science and technology; Reliability engineering; Thermal degradation;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2008.2005321
Filename
4655596
Link To Document