Microelectromechanics, nanomechanisms, and tips

Summary form only given. The MEMS (microelectromechanical systems) technology has been scaled down to submicron dimensions, and has been integrated with nanometer-scale tips and deep submicron moving transistors. Integrated nanostructure mechanisms add a new dimension to mesoscopic physics, microinstruments, microsensors, and microactuators. The fabrication and operation of movable, integrated nanostructure mechanisms that produce nm-scale, precision motion are examined. Self-supporting, movable using single-crystal silicon springs and electric-field drive structures with integrated, movable field emission and tunneling tips are discussed. Movable mechanical structures with cross-sectional dimensions of 150 nm×1000 nm have been fabricated using single-crystal silicon. The nanofabrication process includes high-resolution e-beam and optical lithographies, anisotropic reactive ion etching, and selective oxidation of silicon. Large, dense arrays of 10-20-nm-diameter tips for field emission electron microscopes or scanned-probe applications have been fabricated using these processes