DocumentCode
960786
Title
Statistics of solder joint alignment for optoelectronic components
Author
McGroarty, John ; Borgensen, P. ; Yost, Boris ; Li, Che-Yu
Author_Institution
Dept. of Mater. Sci. & Eng., Cornell Univ., Ithaca, NY, USA
Volume
16
Issue
5
fYear
1993
fDate
8/1/1993 12:00:00 AM
Firstpage
527
Lastpage
529
Abstract
The use of an area array of solder joints allows the self-alignment of a large number of components in microelectronic packages. The sensitivity to statistical variations in solder joint volumes is investigated. The analysis shows that sufficiently large arrays of randomly distributed volumes lead to very narrow distributions in the height and tilt of one component relative to another
Keywords
optoelectronic devices; packaging; soldering; statistical analysis; area array; microelectronic packages; optoelectronic components; self-alignment; solder joint alignment; solder joint volumes; statistical variations; Lead; Lithography; Optical waveguides; Packaging; Reproducibility of results; Silicon; Soldering; Springs; Statistics; Waveguide lasers;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.239883
Filename
239883
Link To Document