DocumentCode
961613
Title
Studies on the nonlinearity effects in dynamic compact model generation of packages
Author
Rencz, Márta ; Székely, Vladimir
Author_Institution
MicReD Ltd., Budapest, Hungary
Volume
27
Issue
1
fYear
2004
fDate
3/1/2004 12:00:00 AM
Firstpage
124
Lastpage
130
Abstract
In this paper, we present a series of measurement and simulation experiments that were accomplished to check the order of magnitude of the error caused by neglecting the temperature dependence of the dynamic compact models of packages. We present a methodology to create nonlinear, temperature dependent compact models. With this methodology we created temperature dependent compact models of packages based both on measured and simulated results and compared the behavior of the temperature dependent model to the temperature independent (linear) model. We have found that neglecting the nonlinearity is acceptable in a moderate temperature range. If the temperature excursion remains below 60-80°C the error is expected to be less than 2-3%. For higher temperature rise the use of nonlinear compact models is recommended.
Keywords
integrated circuit modelling; integrated circuit packaging; thermal analysis; thermal management (packaging); 60 to 80 C; compact thermal modeling; dynamic compact model; linear model; nonlinear compact models; nonlinearity effects; package generation; temperature dependence; temperature dependent compact models; temperature independent model; Conducting materials; Electronic packaging thermal management; Government; Helium; Linearity; Semiconductor materials; Steady-state; Temperature dependence; Temperature distribution; Thermal conductivity;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2004.825750
Filename
1288315
Link To Document