• DocumentCode
    961613
  • Title

    Studies on the nonlinearity effects in dynamic compact model generation of packages

  • Author

    Rencz, Márta ; Székely, Vladimir

  • Author_Institution
    MicReD Ltd., Budapest, Hungary
  • Volume
    27
  • Issue
    1
  • fYear
    2004
  • fDate
    3/1/2004 12:00:00 AM
  • Firstpage
    124
  • Lastpage
    130
  • Abstract
    In this paper, we present a series of measurement and simulation experiments that were accomplished to check the order of magnitude of the error caused by neglecting the temperature dependence of the dynamic compact models of packages. We present a methodology to create nonlinear, temperature dependent compact models. With this methodology we created temperature dependent compact models of packages based both on measured and simulated results and compared the behavior of the temperature dependent model to the temperature independent (linear) model. We have found that neglecting the nonlinearity is acceptable in a moderate temperature range. If the temperature excursion remains below 60-80°C the error is expected to be less than 2-3%. For higher temperature rise the use of nonlinear compact models is recommended.
  • Keywords
    integrated circuit modelling; integrated circuit packaging; thermal analysis; thermal management (packaging); 60 to 80 C; compact thermal modeling; dynamic compact model; linear model; nonlinear compact models; nonlinearity effects; package generation; temperature dependence; temperature dependent compact models; temperature independent model; Conducting materials; Electronic packaging thermal management; Government; Helium; Linearity; Semiconductor materials; Steady-state; Temperature dependence; Temperature distribution; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.825750
  • Filename
    1288315