• DocumentCode
    961639
  • Title

    Computation of natural convection in channels with pin fins

  • Author

    Boyalakuntla, Dhanunjay S. ; Murthy, Jayathi Y. ; Amon, Cristina H.

  • Author_Institution
    Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    27
  • Issue
    1
  • fYear
    2004
  • fDate
    3/1/2004 12:00:00 AM
  • Firstpage
    138
  • Lastpage
    146
  • Abstract
    In this paper, we numerically analyze the possibility of using buoyant flow in the display panel of a laptop for electronics cooling. Three-dimensional (3-D) channels with embedded pin fin arrays are analyzed using an unstructured finite volume method. Studies have been performed with a uniform heat flux boundary condition applied on the inner wall as well as for a constant inner wall temperature condition; the outer wall in all cases is exposed to the ambient. A single periodic module is selected in the lateral direction. In the axial mean flow direction, however, the entire height of the display channel is considered. Buoyancy has been modeled using Boussinesq approximation. A range of Rayleigh numbers, panel inclinations, and pin fin arrangements are considered. Local and global flow and heat transfer results are obtained including Nusselt numbers as well as local temperature and velocity fields. The results are useful in designing augmented cooling schemes in portable electronics.
  • Keywords
    approximation theory; channel flow; cooling; finite volume methods; flow simulation; natural convection; 3D channels; Boussinesq approximation; Nusselt numbers; Rayleigh numbers; augmented cooling schemes; axial mean flow direction; buoyant flow; display channel; display panel; electronics cooling; embedded pin fin arrays; global flow; heat flux boundary condition; heat transfer; inner wall temperature condition; lateral direction; local flow; local temperature; natural convection; panel inclinations; periodic module; pin fin arrangements; pin fin spacing; unstructured finite volume method; velocity fields; Boundary conditions; Displays; Electronics cooling; Finite volume methods; Heat transfer; Mechanical engineering; Portable computers; Temperature; Thermal conductivity; Viscosity;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.825751
  • Filename
    1288317