Exothermic reaction induced eutectic Pb-Sn solder ball melting in the underfill curing process

Author

Kwon, Woon-Seong ; Jang, Se-Young ; Paik, Kyung-Wook

Author_Institution

Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea

Volume

27

Issue

1

fYear

2004

fDate

3/1/2004 12:00:00 AM

Firstpage

172

Lastpage

176

Abstract

The effects of exothermic heat generated during underfill curing on the integrity of the solder bumped package, which is an important issue for the package reliability, have been overlooked. In this study, theoretical exotherm of underfill materials during underfill curing has been calculated using a differential scanning calorimeter (DSC) at cure temperature range from 100°C to 200°C. The calculated exotherm was compared with the exotherm profile measured at the typical cure temperature. The effects of cure temperature, amount of underfill, and initial underfill curing temperature on the exotherm profile of underfill materials have been investigated.

Keywords

calorimeters; curing; flip-chip devices; integrated circuit packaging; integrated circuit reliability; lead alloys; soldering; tin alloys; DSC; cure temperature; differential scanning calorimeter; eutectic Pb-Sn solder ball; exotherm profile; exothermic heat; exothermic reaction; flip chip; package reliability; solder ball melting; solder bumped package; underfill curing process; underfill materials; Assembly; Curing; Electronics packaging; Flip chip; Materials reliability; Materials science and technology; Plastic packaging; Semiconductor device measurement; Temperature distribution; Testing;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2004.825753

Filename

1288322