• DocumentCode
    961971
  • Title

    Conductivity properties of narrow-channel polysilicon thin-film transistors

  • Author

    Yamauchi, N. ; Hajjar, J.-J.J. ; Reif, R. ; Nakazawa, K. ; Tanaka, Kiyoshi

  • Author_Institution
    MIT, Cambridge, MA, USA
  • Volume
    36
  • Issue
    11
  • fYear
    1989
  • fDate
    11/1/1989 12:00:00 AM
  • Firstpage
    2622
  • Lastpage
    2623
  • Abstract
    Summary form only given. The effect of the narrow channel width on performance of thin-film transistors (TFTs) is evaluated. To this end, the authors fabricated coplanar, n-channel TFTs with a fixed gate length of 20 mu m and channel widths ranging from 20 mu m to half a micrometer. The dependences of threshold voltage, grain-boundary trap density, and transconductance on the channel width were measured. A drastic decrease in the threshold voltage was observed as the channel width W was reduced to a few micrometers. The grain-boundary trap density was also found to decrease sharply when W was decreased to below a few micrometers. The transconductance, on the other hand, was found to be slightly higher than the value expected from its linear relationship with W. This translated into an increase in the effective mobility for TFTs with small channel widths. These results demonstrate the existence of regions in the channel near the polysilicon film edges where the grain-boundary trap density is much less than in the rest of the channel.
  • Keywords
    carrier mobility; electric admittance; elemental semiconductors; grain boundaries; silicon; thin film transistors; 20 micron; Si; channel widths; effective mobility; gate length; grain-boundary trap density; n-channel TFTs; narrow-channel polysilicon thin-film transistors; polysilicon film edges; threshold voltage; transconductance; Conductivity; Current-voltage characteristics; Density measurement; Electrodes; Etching; Resonance; Semiconductor films; Semiconductor thin films; Silicon on insulator technology; Thin film transistors; Threshold voltage; Transconductance; Wafer bonding;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.43745
  • Filename
    43745