DocumentCode
964658
Title
Guest Editor´s Comments
Author
Balde, J.
Author_Institution
Interconnection Decision Consultings, NJ and Guest Editor, CHMT
Volume
6
Issue
3
fYear
1983
fDate
9/1/1983 12:00:00 AM
Firstpage
226
Lastpage
226
Keywords
Connectors; Electronics packaging; Failure analysis; Heat transfer; Information analysis; Integrated circuit interconnections; Integrated circuit packaging; Shape; Societies; Thermal expansion;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1983.1136175
Filename
1136175
Link To Document