• DocumentCode
    964658
  • Title

    Guest Editor´s Comments

  • Author

    Balde, J.

  • Author_Institution
    Interconnection Decision Consultings, NJ and Guest Editor, CHMT
  • Volume
    6
  • Issue
    3
  • fYear
    1983
  • fDate
    9/1/1983 12:00:00 AM
  • Firstpage
    226
  • Lastpage
    226
  • Keywords
    Connectors; Electronics packaging; Failure analysis; Heat transfer; Information analysis; Integrated circuit interconnections; Integrated circuit packaging; Shape; Societies; Thermal expansion;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1983.1136175
  • Filename
    1136175