DocumentCode

964766

Title

Hot chips 15 - scaling the silicon mountain

Author

Flynn, Michael ; Dubey, Pradeep

Author_Institution

Stanford University

Volume

24

Issue

2

fYear

2004

Firstpage

7

Lastpage

9

Keywords

Chip scale packaging; Cryptography; Decoding; Encoding; Power system reliability; Process design; Robustness; Silicon; Sun; System testing;

fLanguage

English

Journal_Title

Micro, IEEE

Publisher

ieee

ISSN

0272-1732

Type

jour

DOI

10.1109/MM.2004.1289275

Filename

1289275