• DocumentCode
    967207
  • Title

    Temperature stable heat sink metallisation for improved bonding of c.w. stripe lasers

  • Author

    Lindstr¿¿m, C. ; Tihanyi, P.

  • Author_Institution
    Institute of Microwave Technology, Stockholm, Sweden
  • Volume
    16
  • Issue
    21
  • fYear
    1980
  • Firstpage
    811
  • Lastpage
    813
  • Abstract
    A heat sink metallisation system for use with indium soldering of semiconductor lasers is presented. The system, consisting of the metals InPtNiCu, is found to be temperature stable during a 1700 h storage test in 120°C. S.I.M.S. inspection detects no deterioration of the indium top layer. Ni is found to be an effective barrier for the Cu atoms in the heat sink and Pt provides good wetting of the indium solder, making the system suitable for large scale bonding procedures.
  • Keywords
    heat sinks; lead bonding; metallisation; semiconductor junction lasers; Cu; In soldering; InPtNiCu; Ni; Pt; heat sink metallisation; semiconductor lasers; wetting;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19800577
  • Filename
    4245348
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=967207