• DocumentCode
    967752
  • Title

    Bond integrity evaluation using transmission scanning acoustic microscopy

  • Author

    Sinclair, D.A. ; Ash, E.A.

  • Author_Institution
    University College London, Department of Electronic & Electrical Engineering, London, UK
  • Volume
    16
  • Issue
    23
  • fYear
    1980
  • Firstpage
    880
  • Lastpage
    882
  • Abstract
    Low frequency transmission scanning acoustic microscopy is capable of revealing voids and delaminations at substantial depths inside a solid material. The technique is demonstrated with reference to the bond between a carbon diamond compound sintered to a steel base. A resolution comparable to the wavelength inside the solid material is achieved.
  • Keywords
    acoustic microscopes; diamond; nondestructive testing; voids (solid); bond integrity evaluation; carbon diamond compound; delaminations; transmission scanning acoustic microscopy; voids;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19800628
  • Filename
    4245401
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=967752