DocumentCode
975904
Title
3-D nFPGA: A Reconfigurable Architecture for 3-D CMOS/Nanomaterial Hybrid Digital Circuits
Author
Dong, Chen ; Chen, Deming ; Haruehanroengra, Sansiri ; Wang, Wei
Author_Institution
Illinois Univ., Urbana-Champaign
Volume
54
Issue
11
fYear
2007
Firstpage
2489
Lastpage
2501
Abstract
In this paper, we introduce a novel reconfigurable architecture, named 3D field-programmable gate array (3D nFPGA), which utilizes 3D integration techniques and new nanoscale materials synergistically. The proposed architecture is based on CMOS nanohybrid techniques that incorporate nanomaterials such as carbon nanotube bundles and nanowire crossbars into CMOS fabrication process. This architecture also has built-in features for fault tolerance and heat alleviation. Using unique features of FPGAs and a novel 3D stacking method enabled by the application of nanomaterials, 3D nFPGA obtains a 4x footprint reduction comparing to the traditional CMOS-based 2D FPGAs. With a customized design automation flow, we evaluate the performance and power of 3D nFPGA driven by the 20 largest MCNC benchmarks. Results demonstrate that 3D nFPGA is able to provide a performance gain of 2.6 x with a small power overhead comparing to the traditional 2D FPGA architecture.
Keywords
CMOS integrated circuits; electronic design automation; field programmable gate arrays; nanotechnology; reconfigurable architectures; 3D nFPGA; 3D stacking method; CMOS fabrication; CMOS nanohybrid; CMOS/nanomaterial hybrid digital circuits; carbon nanotube bundles; design automation flow; integration technique; nanoscale material; nanowire crossbars; reconfigurable architecture; CMOS digital integrated circuits; CMOS process; CMOS technology; Carbon nanotubes; Digital circuits; Fabrication; Fault tolerance; Field programmable gate arrays; Nanostructured materials; Reconfigurable architectures; 3-D integration; nanoelectronics; nanotube; nanowire; performance; reconfigurable logic;
fLanguage
English
Journal_Title
Circuits and Systems I: Regular Papers, IEEE Transactions on
Publisher
ieee
ISSN
1549-8328
Type
jour
DOI
10.1109/TCSI.2007.907844
Filename
4383239
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