• DocumentCode
    985936
  • Title

    Failure mechanism models for ductile fracture

  • Author

    Dasgupta, Abhijit ; Hu, Jun Ming

  • Author_Institution
    CALCE Electron. Package Res. Center, Maryland Univ., College Park, MD, USA
  • Volume
    41
  • Issue
    4
  • fYear
    1992
  • fDate
    12/1/1992 12:00:00 AM
  • Firstpage
    489
  • Lastpage
    495
  • Abstract
    This tutorial illustrates design situations where ductile fracture of some components can compromise system performance, thereby acting as an overstress failure mechanism. Analytic (physics-of-failure) methods, based on continuum fracture mechanics principles, are presented to design against such failures. Examples illustrate the use of these models in practical design situations in mechanical engineering and electronic packaging. The design equations are based on continuum mechanics rather than on molecular micromechanics, and can be implemented in an engineering design environment. The associated stress analysis of ten requires numerical finite-element techniques. The methods for material-property characterizations have matured appreciably over the past 40 years and are specified in engineering handbooks
  • Keywords
    ductile fracture; fracture mechanics; packaging; analytic physics-of-failure methods; continuum fracture mechanics principles; continuum mechanics; ductile fracture; electronic packaging; engineering design; material-property characterizations; mechanical engineering; numerical finite-element techniques; overstress failure mechanism; stress analysis; Design engineering; Educational institutions; Electronics packaging; Failure analysis; Mechanical engineering; Plastics; Reliability engineering; Solid modeling; Strain measurement; Stress;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.249573
  • Filename
    249573