DocumentCode
985936
Title
Failure mechanism models for ductile fracture
Author
Dasgupta, Abhijit ; Hu, Jun Ming
Author_Institution
CALCE Electron. Package Res. Center, Maryland Univ., College Park, MD, USA
Volume
41
Issue
4
fYear
1992
fDate
12/1/1992 12:00:00 AM
Firstpage
489
Lastpage
495
Abstract
This tutorial illustrates design situations where ductile fracture of some components can compromise system performance, thereby acting as an overstress failure mechanism. Analytic (physics-of-failure) methods, based on continuum fracture mechanics principles, are presented to design against such failures. Examples illustrate the use of these models in practical design situations in mechanical engineering and electronic packaging. The design equations are based on continuum mechanics rather than on molecular micromechanics, and can be implemented in an engineering design environment. The associated stress analysis of ten requires numerical finite-element techniques. The methods for material-property characterizations have matured appreciably over the past 40 years and are specified in engineering handbooks
Keywords
ductile fracture; fracture mechanics; packaging; analytic physics-of-failure methods; continuum fracture mechanics principles; continuum mechanics; ductile fracture; electronic packaging; engineering design; material-property characterizations; mechanical engineering; numerical finite-element techniques; overstress failure mechanism; stress analysis; Design engineering; Educational institutions; Electronics packaging; Failure analysis; Mechanical engineering; Plastics; Reliability engineering; Solid modeling; Strain measurement; Stress;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/24.249573
Filename
249573
Link To Document