Microelectromechanical systems

Author

Mehregany, Mehran

Author_Institution

Dept. of Electr. Eng. & Appl. Phys., Case Western Reserve Univ., Cleveland, OH, USA

Volume

9

Issue

4

fYear

1993

fDate

7/1/1993 12:00:00 AM

Firstpage

14

Lastpage

22

Abstract

The microfabrication techniques used to develop high-performance closed-loop-controlled microelectromechanical systems (MEMS) are discussed. A generalized MEMS could consist of mechanical components, sensors, actuators, and electronics, all integrated in the same environment. Bulk and surface micromachining, substrate bonding, and electroforming in conjunction with X-ray lithography, all integral components of silicon micromachining, are described. The development of a materials base for MEMS and a variety of physical phenomena for microactuator applications that have recently been demonstrated are reviewed. The applications and future trends of MEMS technologies are discussed.<>

Keywords

X-ray lithography; closed loop systems; electric actuators; electric sensing devices; integrated circuit technology; mechatronics; micromechanical devices; small electric machines; Si; X-ray lithography; actuators; closed-loop-controlled; electroforming; integrated electronics; mechanical components; microelectromechanical systems; microfabrication techniques; micromachining; sensors; substrate bonding; Actuators; Bonding; Mechanical sensors; Microactuators; Microelectromechanical systems; Micromachining; Micromechanical devices; Sensor phenomena and characterization; Silicon; X-ray lithography;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/101.250229

Filename

250229