DocumentCode
999650
Title
Utilizing Diode Characteristics for GaN HEMT Channel Temperature Prediction
Author
Darwish, Ali M. ; Bayba, Andrew J. ; Hung, H. Alfred
Author_Institution
Army Res. Lab., Adelphi, MD
Volume
56
Issue
12
fYear
2008
Firstpage
3188
Lastpage
3192
Abstract
Measuring channel temperature in GaN high-electron mobility transistors (HEMTs) is challenging due to the submicrometer dimensions of the gate fingers. The HEMT characteristics are electrically and thermally dependent. The channel temperature is measured using the Schottky gate-diode forward characteristics and compared with results of simulation, theory, and experimental evidence. The pulsed gate-diode forward resistance and threshold voltage predict channel temperatures that agree well with other methods. The technique presented provides a fast, easily implementable methodology for estimating channel temperature.
Keywords
III-V semiconductors; Schottky diodes; electrical resistivity; gallium compounds; high electron mobility transistors; wide band gap semiconductors; GaN; HEMT; Schottky gate-diode forward characteristics; channel temperature; high-electron mobility transistors; pulsed gate-diode forward resistance; threshold voltage; Channel temperature; GaN; field-effect transistor (FET); high-electron mobility transistor (HEMT); reliability; thermal resistance;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2008.2007364
Filename
4682665
Link To Document