Diode laser soldering using a lead-free filler material for electronic packaging structures

As of today, several lead-free soldering pastes have been qualified for currently used soldering process. Regarding the new potential of laserassisted soldering processes, the behaviour of the SnAgCu soldering paste requires, however, new investigations. In the first part of this study, the specific temperature profile of a laser soldering process is investigated using a high power diode laser (HPDL). These experimental results are compared to a thermal simulation developed for this specific application. The second part of this work deals with the diffusion of the tin-based filler material through the nickel barrier using the information extracted from the temperature simulations