Title of article :
Influence of glyphosate on the copper dissolution in phosphate buffer
Author/Authors :
C.F.B. Coutinho *، نويسنده , , M.O. Silva، نويسنده , , S.A.S. Machado، نويسنده , , L.H. Mazo، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Pages :
6
From page :
3270
To page :
3275
Abstract :
The electrochemical behavior of copper microelectrode in phosphate buffer in the presence of glyphosate was investigated by electrochemical techniques. It was observed that the additions of glyphosate in the phosphate buffer increased the anodic current of copper microelectrode and the electrochemical dissolution was observed. This phenomenon could be associated with the Cu(II) complexation by glyphosate forming a soluble complex. Physical characterization of the surface showed that, in absence of glyphosate, an insoluble layer covered the copper surface; on the other hand, in presence of glyphosate, it was observed a corroded copper surface with the formation of glyphosate complex in solution.
Keywords :
Copper dissolution , Passivation , complex , Glyphosate
Journal title :
Applied Surface Science
Serial Year :
2007
Journal title :
Applied Surface Science
Record number :
1003323
Link To Document :
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