Abstract :
The current research explores the formation of protective layers on copper, zinc and copper–zinc (Cu–10Zn and Cu–40Zn) alloys in chloride
solution containing benzotriazole (BTAH), by use of electrochemical techniques, atomic force microscopy (AFM) and X-ray photoelectron
spectroscopy (XPS). Electrochemical reactions and surface products formed at the open circuit potential and as a function of the potential range are
discussed. The addition of benzotriazole to aerated, near neutral 0.5 M NaCl solution affects the dissolution of copper, zinc, Cu–10Zn and Cu–
40Zn alloys. The research also compares the inhibition efficiency and Gibbs adsorption energies of the investigated process. Benzotriazole,
generally known as an inhibitor of copper corrosion is also shown to be an efficient inhibitor for copper–zinc alloys and zinc metal. The surface
layer formed on alloys in BTAH-inhibited solution comprised both oxide and polymer components, namely Cu2O and ZnO oxides, and Cu(I)-BTA
and Zn(II)-BTA polymers. The formation of this mixed copper–zinc oxide polymer surface film provides an effective barrier against corrosion of
both metal components in chloride solution.
Keywords :
Copper , Brass , benzotriazole , inhibition