Study on fabrication of the superhydrophobic sol–gel films based on copper wafer and its anti-corrosive properties

In the present study, superhydrophobic copper wafer was prepared by a sol–gel deposition method. Different molar ratios of vinyltrimethoxysilane (VTES), ethanol (EtOH), water (H2O) and ammonia water (NH3·OH) were involved in this research. The morphologies, chemical compositions and hydrophobicity of the films were analyzed by scanning electron microscopy (SEM), energy dispersive X-ray detector (EDX), Fourier transfer infrared spectrometer (FTIR) and water contact angle measurement (CA). It was shown by the surface morphological study that different structures, such as pyramid-shaped protrusions, nipple-shaped protrusions or ball-shaped silica particles, were distributed on the copper substrate. The films had a high water contact angle larger than 155.4°. The durability properties revealed that the films had a good superhydrophobicity deposited in 3.5 wt.% sodium chloride solution for up to 14 days.