Implication of electrodeposition parameters on the architecture behavior of MWCNT – incorporated metal matrix

Densely populated multi wall carbon nano tube (MWCNT)-Cu film was fabricated for the first time through electrochemical deposition from an optimized copper bath under different operating conditions. The distribution of carbon nano tube (CNT) within the copper matrix and the morphology of Cu-MWCNT deposit were modified with respect to applied conditions such as quiescent, agitation and sonication employed during electrodeposition. Surface morphology showed a range of pattern varying from stacked layer structure of Cu-MWCNT to vertical alignment of MWCNT. Electrochemical analysis shows shift in cathode potential with respect to double layer modification under various conditions employed. Presence of MWCNT within the copper matrix was revealed by XRD analysis from the characteristic peak observed for carbon. XPS and EDXA analysis of the film also showed characteristic peak for Carbon. The present work reports on tuning the morphology of Cu-MWCNT composite plate through manipulation of deposition parameters for obtaining populated CNT network within metal matrix.