Abstract :
In this paper, we summarize how the introduction of in-line TXRF monitoring provides detailed analytical information on aluminum, titanium and molybdenum contamination levels in order to improve several process steps from front-end processing, minimize product yield loss and make it possible to successfully manufacture multiple products and process geometries in the same fabrication platform.
Keywords :
Front-end or FEOL (processing of semiconductor wafers till metal layer1 in order to test the transistors performance via electrical testing) , Back-end or BEOL (additional processing where interconnect and insulators are added to complete circuitry prior to wafer dicing and packaging) , Pad etch window (window opening for contact via plasma etch) , TXRF , SIMS , TOF-SIMS , EMMI (emission spectroscopy , delamination overheating metallization layers material characterization technique) , contamination
