Strain relaxation in SiGe layer during wet oxidation process

The strain relaxation in SiGe layer on silicon substrate during wet oxidation at 1000 °C was investigated. It was proposed that the competition between Ge accumulation and diffusion led to different strain-relaxation behaviors. At the very beginning, Ge atoms at the oxidizing interface were quickly accumulated due to the high oxidation rate resulting in the additional nucleation of misfit dislocations (therefore a lot of threading dislocations) to relieve stress after the thickness of the Ge condensed layer was larger than the critical value. And then, when the Ge accumulation rate was less than the diffusion rate, Ge content started to decrease from a maximum value and the strain in the SiGe layer was mainly relieved through surface roughing and the degree of strain relaxation reached a maximum. When the samples were further oxidized, Ge accumulation could be neglected because of the self-limiting oxidation and the Ge diffusion dominated the consequent processes. As a result, Ge content at the interface was reduced, with the contribution of the strain relaxation in SiO2 viscously, leading to the decrease of degree of strain relaxation in the SiGe layers slowly.