Title of article :
Dry etching characteristics of GaN for blue/green light-emitting diode fabrication
Author/Authors :
K.H. Baik، نويسنده , , S.J., Pearton, J.W., Corbett, M., Stavola، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2009
Pages :
4
From page :
5948
To page :
5951
Abstract :
The etch rates, surface morphology and sidewall profiles of features formed in GaN/InGaN/AlGaN multiple quantum well light-emitting diodes by Cl2-based dry etching are reported. The chlorine provides an enhancement in etch rate of over a factor of 40 relative to the physical etching provided by Ar and the etching is reactant-limited until chlorine gas flow rates of at least 50 standard cubic centimeters per minute. Mesa sidewall profile angle control is possible using a combination of Cl2/Ar plasma chemistry and SiO2 mask. N-face GaN is found to etch faster than Ga-face surfaces under the same conditions. Patterning of the sapphire substrate for improved light extraction is also possible using the same plasma chemistry.
Keywords :
Dry etching , GaN
Journal title :
Applied Surface Science
Serial Year :
2009
Journal title :
Applied Surface Science
Record number :
1011407
Link To Document :
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