Stress distribution and hillock formation in Au/Pd thin films as a function of aging treatment in capacitor applications

Effect of quenching in different media on hillock formation and electrical resistivity has been studied in the Au–Pd layers. Oxygen was released from substrate due to substrate relaxation process. It was suggested that hillocks appear on the triple junction grain boundaries. However, lower electrical resistivity has been seen in the sample which quenched in the air. It was concluded that grain boundary scattering decreases the conductivity of the quenched films due to higher density of dislocations.