Author/Authors :
C.S. Wu and K.H. Chen، نويسنده , , Wenhsing Wu، نويسنده , , Byung Hwan Chu، نويسنده , , C.Y. Chang، نويسنده , , Jenshan Lin، نويسنده , , S.J., Pearton, J.W., Corbett, M., Stavola، نويسنده , , D.P. Norton، نويسنده , , F. Ren، نويسنده ,
Abstract :
We have demonstrated UV excimer laser drilled a submicron via hole with an entrance diameter of 300 nm inside a via hole with an entrance diameter of 5 μm. The smaller via hole formation was due to the refocusing of the reflected UV light from the tapered side-wall of the bigger via hole and the wave-guide effect of the light trapped inside the smaller via hole. The aspect ration of the smaller vias hole was >200. This method could be used to fabricate microfilters or nanopores.
Keywords :
UV excimer laser , Laser drill , Microfilters , Nanopores
