Title of article :
Properties of AlN grown by plasma enhanced atomic layer deposition
Author/Authors :
Markus Bosund، نويسنده , , Timo Sajavaara، نويسنده , , Mikko Laitinen، نويسنده , , Teppo Huhtio، نويسنده , , Matti Putkonen، نويسنده , , Veli-Matti Airaksinen، نويسنده , , Harri Lipsanen، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2011
Pages :
4
From page :
7827
To page :
7830
Abstract :
The influence of growth parameters on the properties of AlN films fabricated by plasma-enhanced atomic layer deposition using trimethylaluminum and ammonia precursors was investigated. The atomic concentrations, refractive index, mass density, crystallinity and surface roughness were studied from the films grown in the temperature range of 100–300 °C with plasma discharge times between 2.5 and 30 s. The AlN films were shown to be hydrogen rich having H concentrations in the range of 13–27 at.% with inverse dependence on the growth temperature. The carbon and oxygen concentrations in the films were less than 2.6% and 0.2%, respectively. The refractive index and mass density of the films correlated with the hydrogen concentration so that higher concentrations (lower growth temperatures) resulted in smaller refractive index and mass density. The film grown at 300 °C was found to be crystalline whereas lower growth temperature produced amorphous films.
Keywords :
Atomic layer deposition , Plasma , Aluminum nitride
Journal title :
Applied Surface Science
Serial Year :
2011
Journal title :
Applied Surface Science
Record number :
1015452
Link To Document :
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