Enhancement of thermal contact conductance for electronic systems

Experimental investigations on thermal contact resistance have been performed. The results of this study will be useful in selecting interstitial materials to enhance the thermal conductance of an electronic component/heat sink assembly. The experimental assembly consists of two specimens: a thick copper plate, electrically heated, and an aluminium water-cooled plate. The two specimens are bolted together and the load is applied using a calibrated torque wrench. Various interstitial materials (seven commercial greases and 12 foils) suitable for the thermal enhancement in electronic systems have been investigated. The variables considered are the bolt torque, the heat transfer rate and the grease or foil thickness. Results show that the most influential parameter is the applied torque. The contact resistance decreases as the heat flux or the film thickness decreases. The highest dimensionless contact conductance factors (E) are achieved with greases (3 < E < 6). Phase change material-coated foils exhibit E-values ranging from 2.5 to 3.5. Graphite or metallic foils have E-values lower than 2 and for silicone foils E is significantly reduced (E < 1). Thus, phase change material-coated foils seem to be very promising materials, since they are efficient, easy to implement and do not migrate and vaporise out of the contact area.