Title of article :
Materials for thermal conduction
Author/Authors :
D.D.L. Chung، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
Pages :
13
From page :
1593
To page :
1605
Abstract :
Materials for thermal conduction are reviewed. They include materials exhibiting high thermal conductivity (such as metals, carbons, ceramics and composites), and thermal interface materials (such as polymer-based and silicate-based pastes and solder).
Keywords :
Thermal conduction , Thermal paste , Thermal contact , Thermal conductivity , Composite , Interface
Journal title :
Applied Thermal Engineering
Serial Year :
2001
Journal title :
Applied Thermal Engineering
Record number :
1023388
Link To Document :
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