Integrated thermal management techniques for high power electronic devices

Within the electronics industry, miniaturisation of silicon components and enhanced performance has led to high power electronic devices with high packing densities. This has identified the future development of very high heat flux components. This paper reviews the development of micro-processing technology and presents a project being carried out to develop combined two-phase heat transfer and heat pipe technology with forced air convection and liquid condenser systems. It also presents a research project being carried out at Newcastle University to develop micro-channel heat exchanger technology.