Air cooling characteristics of a uniform square modules array for electronic device heat sink

Air-cooling characteristics of an electronic devices heat sink with various square modules array have been experimentally investigated. Flowing air velocities of 3.24–6.84 m/s were circulated through a channel of 0.1 m width and 0.02 or 0.03 m height. Aluminum block of module array was made and the base temperature of modules array of 40–100 °C were adapted to estimate the average heat transfer coefficient between the flowing air and modules array outer surfaces. Four modules arrays of 9, 16, 25 and 36 square poles in the same surface area were protruded to validate the effect of module to channel height ratio, α. The results indicated that the average heat transfer coefficient little increased with increasing the modules array temperature, but the increase was significantly higher with increasing the flowing air velocities. The increasing of module to channel height ratio seems to increase the average heat transfer coefficient. The experimental data of average Nusselt number were correlated as 0.11 Re0.77Pr0.32 within ±15%, and 0.84 Re0.58Pr0.25 α0.47 within ±18%. The obtained correlations were compared with other previous data correlation and the comparison was quite good.