Title of article :
Effect of electroplating on the thermal conductance of fin–tube interface
Author/Authors :
Wui-wai Cheng، نويسنده , ,
Chakravarti Madhusudana، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Abstract :
This paper presents the experimental results of thermal contact conductance, heat transfer and interfacial temperature drop of finned tube heat exchanger test specimens. The results were based on the measured temperatures at several locations on the test specimen so that the thermal contact conductance could be directly determined. Each test specimen was assembled by mechanically expanding seven tubes into a single fin. The geometry of the specimens was based on a commonly used model of heat exchangers. The specimens included one bare tube (non-coated) specimen and four electroplated tube specimens. The plating metals were zinc, tin, silver and gold. The thickness of the plating in each case was 5 μm.
Experiments have been conducted in both vacuum and nitrogen. Maximum enhancement was obtained when the tube was coated with tin. This indicates that, although the thermal conductivity is important, the softness of the plating material also plays an important role in enhancing the thermal conductance of the interface. The presence of an interstitial gas such as nitrogen is beneficial for the heat transfer and the thermal contact conductance. It is also noted that the interfacial temperature drop alone does not fully reflect the efficiency of the heat exchanger.
Keywords :
Thermal contact resistance , Electroplating material , Bullet size , Thermal contact conductance , Interstitial gas , Fin–tube heat exchanger
Journal title :
Applied Thermal Engineering
Journal title :
Applied Thermal Engineering