Thermal conductivity and thermal contact conductance studies on Al2O3/Al–AlN metal matrix composite

Al2O3/Al–AlN is a metal matrix composite (MMC) used for making heat sink of electronic devices. This paper presents the detailed investigations carried out on thermal contact resistance across this MMC contact in vacuum at different contact pressures. The experimental results are compared with the theoretical models available in the literature for metallic contacts and they are found to be in good agreement with each other.