• Title of article

    Transient natural convection in parallelogrammic enclosures with isothermal hot wall. Experimental and numerical study applied to on-board electronics

  • Author/Authors

    A. Baïri، نويسنده , , J.M. Garc?a de Mar?a، نويسنده , , N. Laraqi، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2010
  • Pages
    11
  • From page
    1115
  • To page
    1125
  • Abstract
    This work treats 2D transient natural convection in closed cavities of parallelogrammic section. Such cavities are formed by two vertical, active walls maintained at different temperatures, connected by a closing channel that can be inclined at an angle α with respect to the horizontal. The channel is adiabatic, the angle of tilt α being defined by the inclination of the upper and lower walls while the fitting lateral ones denote the parallelogram-shape section of the cavity. We present the temperature fields and the flow lines at some representative instants of the transient state for all angles treated. The temporal evolution of the maximum Nusselt number and maximum velocity near the hot wall are determined for all the angles and compared to those of the square cavity. The evolution of the local Nusselt number on the active hot wall is also presented for the transient and steady states, what constitutes the main original contribution of the present work. Numerical results are complemented by experimental thermal measurements at steady state. The small deviation found between measurements and calculations serve to validate the model used and to properly size real devices. This study is done for several Rayleigh numbers Ra whose high values, varying between 105 and 109, are representative of engineering assemblies, as it is the case of on-board electronics.
  • Keywords
    Thermoregulation of avionics , Parallelogrammic cavity , Finite volume method , Experimental data , Heat transfer , Transient natural convection , Isothermal source , Applied thermal engineering
  • Journal title
    Applied Thermal Engineering
  • Serial Year
    2010
  • Journal title
    Applied Thermal Engineering
  • Record number

    1045139