Thermal performance of plate-type loop thermosyphon at sub-atmospheric pressures

This experimental study examines the thermal performance of a newly devised plate-type two-phase loop thermosyphon with cooling applications to electronic boards of telecommunication systems. The evaporation section is configured as the inter-connected multi channels to emulate the bridging boiling mechanism in pulsating thermosyphon. Two thermosyphon plates using water as the coolant with filling ratios (FR) of 0.22 and 0.32 are tested at sub-atmospheric pressures. The vapor–liquid flow images as well as the thermal resistances and effective spreading thermal conductivities are individually measured for each thermosyphon test plate at various heating powers. The high-speed digital images of the vapor–liquid flow structures reveal the characteristic boiling phenomena and the vapor–liquid circulation in the vertical thermosyphon plate, which assist to explore the thermal physics for this type of loop thermosyphon. The bubble agglomeration and pumping action in the inter-connected boiling channels take place at metastable non-equilibrium conditions, leading to the intermittent slug flows with a pulsation character. Such hybrid loop-pulsating thermosyphon permits the vapor–liquid circulation in the horizontal plate. Thermal resistances and spreading thermal conductivities detected from the present thermosyphon plates; the vapor chamber flat plate heat pipe and the copper plate at free and forced convective cooling conditions with both vertical and horizontal orientations are cross-examined. In most telecommunication systems and units, the electrical boards are vertical so that the thermal performance data on the vertical thermosyphon are most relevant to this particular application.