Studies on thermal properties and thermal control effectiveness of a new shape-stabilized phase change material with high thermal conductivity

In order to overcome the difficulty of conventional phase change materials (PCMs) in packaging, the shape-stabilized PCMs are proposed to be used in the electronic device thermal control. However, the conventional shape-stabilized PCMs have the drawback of lower thermal conductivity, so a new shape-stabilized PCM with high thermal conductivity, which is suitable for thermal control of electronic devices, is prepared. The thermal properties of n-octadecane-based shape-stabilized PCM are tested and analyzed. The heat storage/release performance is studied by numerical simulation. Its thermal control effect for electronic devices is also discussed. The results show that the expanded graphite (EG) can greatly improve the thermal conductivity of the material with little effect on latent heat and phase change temperature. When the mass fraction of EG is 5%, thermal conductivity has reached 1.76 W/(m K), which is over 4 times than that of the original one. Moreover, the material has larger latent heat and good thermal stability. The simulation results show that the material can have good heat storage/release performance. The analysis of the effect of thermal parameters on thermal control effect for electronic devices provides references to the design of phase change thermal control unit.