Title of article :
LTCC INTERCONNECT MODELING BY SUPPORT VECTOR REGRESSION
Author/Authors :
By L. Xia، نويسنده , , R.-M. Xu، نويسنده , , and B. Yan ، نويسنده ,
Issue Information :
ماهنامه با شماره پیاپی سال 2007
Pages :
9
From page :
67
To page :
75
Abstract :
In this paper, we introduce a new method: support vector regression (SVR) method to modeling low temperature co-fired ceramic (LTCC) multilayer interconnect. SVR bases on structural risk minimization (SRM) principle, which leads to good generalization abi
Journal title :
Progress In Electromagnetics Research
Serial Year :
2007
Journal title :
Progress In Electromagnetics Research
Record number :
1054351
Link To Document :
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