• Title of article

    AC impedance studies of copper doped silica glass

  • Author/Authors

    Sung-Ping Szu، نويسنده , , Chung-Yi Lin، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2003
  • Pages
    6
  • From page
    295
  • To page
    300
  • Abstract
    Copper doped silica glass with nominal composition 10Cu (mol%)–90SiO2 (mol%) is prepared using the sol–gel method. The dc conductivities are Arrhenius temperature dependent with activation energy 1.0 eV. The conducting species is attributed to the un-reduced Cu+ ions. The Kohlrausch–Williams–Watts function, φ(t)=exp[−(t/τ0)β], and the coupling model are utilized for analyzing electric modulus at various temperatures. The analyses indicate that the ionic relaxation is coupled with the structural relaxation, the decreasing of β at 550 °C is due to the approaching the glass transition temperature of the sample. The dielectric constants at high frequency limit increase with temperature initially and then level off at temperatures above 550 °C; while, the dissipation factors increase exponentially with temperatures. The increase of dielectric constants and dissipation factors with temperature changes are explained by the net polarization in the medium at high frequency.
  • Keywords
    copper , AC impedance , Silica glass , Sol–gel
  • Journal title
    Materials Chemistry and Physics
  • Serial Year
    2003
  • Journal title
    Materials Chemistry and Physics
  • Record number

    1061882